Senior Principal Package Development Engineer ID1296

Senior Principal Package Develoment Engineer, Shanghai, China

You are going to be part of

The backend technology team (BET) develops and releases new package technology, materials, and package concepts for RF products. The BET is a part of the Ampleon CTO organization with a wide range of package and assembly backgrounds and competencies. You will work with a global team to drive from package design to release covering the entire value chain.

A look into the life of a Senior Principal Package Development Engineer
As a BET Package Development Engineer, you will work closely with Ampleon business unit product teams with the delivery of package and assembly process releases. In this role, you will work with global multiple functional teams across design, product, equipment, testing, quality, procurement, and supply chain. You will also work closely with our supplier and/or assembly Subcon. You will be a driver tracking cross-functional dependencies, managing new package releases from design to industrialization, resolving package technical issues, and setting technology reviews. You should be an excellent goal and timeline driver and executer with strong knowledge of RF packaging. You will focus on achieving required outcomes on time with a large group of team members while also being flexible in your approach toward release.

Responsibility
  • You will carry out MCM package development activities from design, simulation to qualification
  • You will have the technical lead for the RF power module package pre-development and development
  • You will collaborate with marketing and BU to define (near) future package specifications to support product roadmaps
  • You will drive the module package from development to industrialization
  • You will attend and drive MCM project technology review meetings
  • You will support RF Engineers with package design, assembly technology, and board assembly to enable optimal product development
  • You will participate in cross-functional reviews such as process characterization, change requests, and process definition
  • You will resolve technical issues in the areas of packaging, process, materials
  • You will develop custom or derivative processes: innovate on product ideas and features, and figure out what works and what doesn’t
  • You will participate in reviewing DFMEA, evaluation results, drawings, control plan, BOM, process specifications, and other pertinent data to ensure the milestone requirements are met
  • You will provide day to day package/process support requirements focusing on cost reduction and efficiency improvement
  • You will have competency enhancement of colleagues through coaching and technical sharing

Your profile
  • Master’s or Ph.D. degree in ME, Chemical, Metallurgical, Materials engineering
  • Minimum 10 years of experience in substrate or PCB fabrication and assembly processes such as wafer-level packaging and multi-chip modules
  • Knowledgeable in assembly processes, materials, and applications for semiconductor packaging
  • Experience in Design for Manufacturing (DFM) for substrate or similar technologies
  • Demonstrated experience working with external vendors as well as internal manufacturing
  • Good understating of IPC standards and JEDEC methodology for component level and board level reliability qualification requirements
  • Detailed understanding of all major wafer, chip, and board-level packaging processes, including advanced packaging techniques such as 3D and 2.5D integration
  • Familiarity with packaging, latest reliability, and fault isolation methods/principle
  • Strong IC packaging materials background including characterization and failure analysis
  • Proficiency with SPC, DOE, FMEA
  • Excellent communication, quality mind, project ownership, organization & interpersonal skills
  • Fluent in English


We offer you
  • A position in an international environment with over 35 nationalities working in cross-functional teams
  • A ‘flat’ organization: informal, flexible, no-nonsense, and hands-on
  • A valuable experience to develop yourself
  • A variety of inspiring events throughout the year, such as various technical conferences, sports and family events, and many more

Are you interested and do you want to amplify a sustainable future? Join Ampleon!

ID 1296
#1044064
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Overzicht

Contractvorm
Permanent
Branche
Engineering
Locatie
Shanghai, China
Vakgebied
Engineering
Salaris
R&D Engineering
Referentie:
1044064

Spreek met een consultant

Spreek met Johan Huisman, de recruiting expert die deze vacature in behandeling heeft, werkzaam in kantoor Tilburg
Hays Tilburg, Ellen Pankhurststraat 1G

Telefoonnummer: +31 6 46891605